[IISE Faculty List] Call for Papers: RAiM 2025: The First International Workshop on Resilient Artificial Intelligence for Manufacturing at IEEE ICDM 2025

[Zeng, Yingyan]

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RAiM 2025: The First International Workshop on Resilient Artificial Intelligence for Manufacturing

RAiM 2025: The 1st International Workshop on Resilient Artificial Intelligence for Manufacturing will be held as a half-day, in-person workshop at the 25th IEEE International Conference on Data Mining (ICDM 2025) in Washington, D.C., USA, on November 12, 2025. RAiM aims to comprehensively address the implications of Artificial Intelligence resilience in Manufacturing Industrial Internet. Despite progress in industrial AI, key challenges remain in maintaining robust performance, such as ensuring resilience to disruptions, detecting failures, adapting in real-time, and recovering from threats like poor data quality or cyberattacks. The RAiM 2025 workshop will integrate expertise in academia and industry to promote original, transdisciplinary research exploring how Artificial Intelligence and Machine Learning can be resiliently trained and deployed in manufacturing, with potential applications in infrastructure, healthcare, energy, human-machine systems, financial technology, etc.

Registration is OPEN! Scan the OR Code for Early Bird/IEEE Member Discount.
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Scope of Topics

We invite submissions of research papers that address, but are not limited to, the following areas:

  *   Reliability/resilience of manufacturing AI models.
  *   AI model robustness and uncertainty quantification.
  *   Manufacturing data quality and data sharing.
  *   Monitoring, diagnosis, and mitigation strategies for manufacturing AI resilience.
  *   Foundation AI models in manufacturing.
  *   Human-in-the-loop AI systems in manufacturing.
  *   Cyber resilience in other applications.
  *   Development of benchmark datasets and open-source AI tools for manufacturing AI modeling.


Keynote Session and Panel Discussion

The half‑day program will feature:
⦁           2 keynotes by leading academics/industry experts
⦁           Peer‑reviewed paper presentations (oral & poster)
⦁           A panel discussion on open challenges and future directions

Submission Format Requirements

  *   Paper length: up to 8 pages of content + up to 2 extra pages for references/appendices (maximum 10 pages total).
  *   Template: following ICDM 2025 guideline<https://nam12.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww3.cs.stonybrook.edu%2F~icdm2025%2Fcfp.html&data=05%7C02%7Ciefac.list%40mailman.clemson.edu%7C8260ced3ee7d4f80a5df08dd9d477b1f%7C0c9bf8f6ccad4b87818d49026938aa97%7C0%7C0%7C638839652643245999%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C60000%7C%7C%7C&sdata=ugiL5fVqoXQOAQIcjNIcgt6tMSwNSTv6b2fDOTa3hqk%3D&reserved=0>
  *   Review: Papers will be peer-reviewed and selected for invited or poster presentations.
  *   Originality: Submissions must be original and not under consideration elsewhere. Duplicate submissions to multiple ICDM workshops are prohibited.
  *   Proceedings: Accepted papers will appear in the IEEE ICDM 2025 Workshop Proceedings (ICDMW) and in IEEE Xplore.

How to Submit
Submit your manuscript as a PDF through the ICDM 2025 Workshop CyberChair portal (Link<https://nam12.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.wi-lab.com%2Fcyberchair%2F2025%2Ficdm25%2Fscripts%2Fsubmit.php%3Fsubarea%3DS46%26undisplay_detail%3D1%26wh%3D%2Fcyberchair%2F2025%2Ficdm25%2Fscripts%2Fws_submit.php&data=05%7C02%7Ciefac.list%40mailman.clemson.edu%7C8260ced3ee7d4f80a5df08dd9d477b1f%7C0c9bf8f6ccad4b87818d49026938aa97%7C0%7C0%7C638839652643265375%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C60000%7C%7C%7C&sdata=%2BNVyzjms4BoRzv%2BH2TFE7viMt77rtVSNidf%2FLWJu74Q%3D&reserved=0>
). Select “RAiM 2025 Workshop” when choosing the submission track.


Important Dates
Paper Submission Deadline:
September 1, 2025
Author Notification:
September 15, 2025
Camera‑Ready & Copyright Form Due:
September 25, 2025
Workshop Date:
November 12, 2025

Attendance & Registration Policy
At least one author must register for the full conference and present the paper in person. Authors who need a U.S. visa should begin the application process early. ICDM does not provide online streaming due to venue constraints.

Workshop Organizers

  *   Dr. Ran Jin, Virginia Tech, jran5 at vt.edu
  *   Dr. Ismini Lourentzou, University of Illinois Urbana‑Champaign, lourent2 at illinois.edu
  *   Dr. Xuan Wang, Virginia Tech, xuanw at vt.edu
  *   Dr. Yingyan Zeng, University of Cincinnati, zengyy at ucmail.uc.edu


Join us in shaping the future of resilient AI for manufacturing by contributing your latest research to RAiM 2025. We look forward to receiving your submissions and to an engaging, interactive workshop at IEEE ICDM 2025. For any questions about scope, submissions, or logistics, please reach out to the Workshop Organizers at mailto:raim2025-idcm at outlook.com.


Thank you for your attention!

Best,
Yingyan

----------------
Yingyan Zeng, Ph.D. (she/her/hers)
Assistant Professor
Industrial & Systems Engineering Program
Department of Mechanical and Materials Engineering
University of Cincinnati
624 Rhodes Hall | Cincinnati, OH 45221, USA
Email: zengyy at ucmail.uc.edu<mailto:zengyy at ucmail.uc.edu>


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