[Iefac.list] Call for abstracts for Logistics and Supply Chain Track at IISE 2019

[Prokle, Michael]

Dear Colleagues:

The Logistics and Supply Chain (LSC) Division of the Institute of Industrial & Systems Engineers (IISE) is sponsoring the Logistics and Supply Chain Track at the 2019 IISE Annual Conference and Expo. The conference is a forum for exchanging knowledge and discoveries in the industrial and systems engineering research and practitioner communities. The 2019 IISE Annual Conference and Expo integrates research and industry under one conference.

As track chairs of the Logistics and Supply Chain Track, we would like to encourage you to contribute to the conference by submitting an abstract. Authors of accepted abstracts will be invited to present their work in a session, choosing either a standard 20‐minute presentation or a new 40‐minute presentation for a lengthier discussion. Each session will be 80 minutes.

In addition to the traditional abstract and presentation, two other options are available for presenting your work:


(1)     Extended Abstract.

(2)     Full Paper.

Important deadlines for the conference are as follows (NOTE: THERE WILL BE NO EXTENSIONS)


§  Abstract Submission Deadline: November 9, 2018

§  Notification of Decision on Abstract: November 30, 2018

§  Submission of Extended Abstracts and Full Papers (optional): January 18, 2019

§  Notification of Decision on Paper: February 19, 2019

§  Final Version of Full Paper Due: March 5, 2019

§  Presenting Author Registration Deadline: March 12, 2019

§  Schedule Published: April 2, 2019

§  2019 IISE Annual Conference and Expo: May 18‐21, 2019

For more information, please visit and see:


§  Attached ‘Call For Paper Announcement’

§  Abstract submission site: https://www.conferenceabstracts.com/IISE2019.htm

§  Conference web site: www.iise.org/annual<http://www.iise.org/annual>

There are also opportunities to organize invited sessions, panels, and tutorials. In addition to research and practitioner presentations, the annual conference offers many opportunities for attendees, including plant tours, networking, and keynote speakers.

We look forward to seeing you in Orlando!

Regards,

Benoit Montreuil ‐ Georgia Institute of Technology, Email: benoit.montreuil at isye.gatech.edu
Murat Erkoc ‐ University of Miami, Email: merkoc at miami.edu
Julie Swan ‐ North Carolina State University, Email: jlswann at ncsu.edu
Ridvan Gedik ‐ University of New Haven, Email: rgedik at newhaven.edu
Michael Prokle ‐ Fortune Brands, Email: m.prokle at northeastern.edu

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